Electronic Design Process Symposium

Energy and Thermal Management of Chips, Systems and Datacenters Necessitates a Return to Fundamentals

Chandrakant Patel

HP

AI: Trailblazing the Next Generation of Semiconductor Innovation

Vishal Khandewal

Synopsys

Harnessing LLMs for Advanced EDA Platforms: Code Generation and Beyond

Akhilesh Kumar

Ansys

The Application of AI to Chip Design

Mark Ren

NVidia

How AI is changing every aspect of EDA, starting from transistor-level simulation

Sathishkumar Balasubramanian

Siemens

Test, Repair and Reliability Challenges of Chip-let Interconnects

Sreejit Chakravarty

Ampere Computing

Artificial Intelligence and Machine Learning for RF and Microwave Design

Jianjun Xu

Keysight

Promises and Challenges of Digital Twin for Semiconductor Manufacturing

Ala Moradian

Applied Materials

Making Data Center Digital Twins a Reality

Paul Harrison

Cadence

Innovating Semiconductor Manufacturing with ML-augmented Digital Twins

Norman Chang

Electronics, Semiconductor,

Optics BU, Ansys

Semiconductors and Artificial Intelligence:The Virtuous Cycle

Pushkar Apte

SEMI

Is AI intelligent?

Ronjon Nag

Stanford Medicine

Trust Based Modeling for Improved Security

Naresh Sehgal

Deeply Human AI

Advancing Hardware Security in the Post-Quantum Cryptography Landscape: Challenges and Solutions

Qian Wang

U. Cal. Merced

Scaling to Meet the Needs of AI

Pradeep Dubey

Intel

The Present and Future of Generative AI: Key Trends and Innovations

Shiva Kintali

R3AI

Emerging Technologies for Computing Paradigm Shift

Brandon Wang

Synopsys

Dual Machine Learning Models for Hardware Quality and Supply Chain Management

Chris Cheng

Hewlett-Packard Enterprise

Enabling Effortless Machine Learning for Embedded Edge Applications

Gopal Hegde

SiMa.ai