Electronic Design Process Symposium

Archive for 2019

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Talks with Archived Presentations

How different is ADAS? [Keynote]

Rob Aitken
ARM
slides (in PDF)

Why Now? Growth and Innovation using HLS and the Need for Standardization

Ellie Burns
Mentor
slides (in PDF)

Design For Thermal Reliability in 7mm

Jae-Gyung Ahn
Xilinx
slides (in PDF)

AI Chips Everywhere, but Where is AI in Chip Design?

Srinivas Bodapati
Intel
slides (in PDF)

Cloud Computing Security

Chris Hotchkiss
Intel
slides (in PDF)

Side Channel Attacks

Nagata Makoto
Kobe University
slides (in PDF)

Hardware Based Security

Gang Qu
ISR
slides (in PDF)

Interactions between Artificial Intelligence and Security

Sohrab Aftabjahani
Intel
slides (in PDF)

Security in Standard Interface Protocols

Zongyao Wen
Synopsys
slides (in PDF)

Trends and Design Methodologies for 3D Multi-Chip(let) IC Packaging

T.V. Narayanan
Cadence
slides (in PDF)

Packaging Materials Characterization and Modeling

S.B. Park
Binghamton U
slides (in PDF)

Advanced Packaging - Changing the World of Wafer Test

Timothy McMullen
FormFactor
slides (in PDF)

Design for Reliability

Craig Hillman
DfR Solutions/ANSYS
slides (in PDF)

The Impact of AI on Semiconductors and EDA [Keynote]

Joe Sawicki
Mentor
slides (in PDF)

Where are we on the road to Artificial Intelligence in Chip Design

Thomas Anderson
Synopsys
slides (in PDF)

Accelerating Semiconductor Manufacturing with Deep Learning

Ajay Baranwal
CDLE
slides (in PDF)

AI accelerated Computational Sciences using Physics and Data Driven Point Cloud Neural Networks

Sanjay Choudhary
Nvidia
slides (in PDF)

AI-enabled Agile IC Design and Manufacturing

David Pan
UT Austin
slides (in PDF)

A Deep Data Approach to Quality, Reliability and Time-to-Market

Raanan Gewirtzman
ProteanTecs
slides (in PDF)

Circuit Reliability Mitigation Techniques and EDA Requirements

Georgios Konstadinidis
Google
slides (in PDF)

Advanced Packaging for Heterogeneous Integration

Ravi V. Mahajan
Intel
slides (in PDF)

Use of AI/Machine Learning in Engineering Simulation and Design [Keynote]

Prith Banerjee
Ansys
slides (in PDF)

Talks Delivered, but without Archived Presentations


Transition From Single-Die SoC to Mulit-Die System-In-Package

Herb Reiter
EDA 2 ASIC

2019 EDPS Program Committee